Broadcom Banks Line Up Record $60B AI Chip Financing for Anthropic

Broadcom's Wall Street banking syndicate is amassing a record $60 billion debt financing package to fund AI chip purchases and infrastructure leases for Anthropic, Bloomberg reported on October 2, 2026 — the latest sign that Wall Street will bankroll the AI buildout at almost any scale. The deal has not yet been formally announced.

Broadcom's headquarters. The chipmaker's Wall Street syndicate is gathering $60 billion in fresh AI chip financing, largely to benefit Anthropic. (Photo: Coolcaesar, CC BY-SA 3.0, via Wikimedia Commons)

How the $60 Billion Stack Is Built

The package comes in two tranches, according to people familiar with the matter cited by Bloomberg:

• $42 billion Class A senior-secured tranche — Bank of America, Citigroup and Morgan Stanley are among the banks preparing to send syndication letters to investors. Broadcom will provide so-called residual value support that effectively backstops this portion. Other banks are expected to be invited to join, and part of the senior notes will likely be refinanced in the bond market later.
• $18 billion Class B junior debt tranche — led by private equity giant Blackstone, which is committing $9 billion from its own funds and plans to syndicate the remainder to other investors.

Anthropic's IPO Prospectus Confirms the Lending

Anthropic's initial public offering prospectus, filed around October 1, 2026, added detail: Broadcom has agreed to lend the AI company up to $42 billion to finance infrastructure spending, Reuters reported. The facility could be convertible into Anthropic equity, and the prospectus flags "potential conflicts of interest" tied to Broadcom's dual role as both chip vendor and lender.

The $42 billion loan would cover roughly one-third of Anthropic's $125.2 billion five-year commitment to lease tensor processing unit (TPU) capacity. About 3.5 gigawatts of Google-TPU capacity — co-designed with Broadcom under a partnership expanded in April — is expected to come online in 2027. Anthropic is expected to become Broadcom's largest chip-design customer next year, per the Bloomberg account.

Round Two of AI Chip Debt

This is not the first act. A $35 billion financing tranche closed in June 2026 under the Broadcom–Apollo–Blackstone AI XPV partnership, which targets more than 20 gigawatts of compute capacity by 2028 using Broadcom's custom chips and networking technology.

The deal also follows Nvidia's August announcement of a $500 billion-plus AI-infrastructure financing partnership with six financial firms, including Blackstone. As AI companies outgrow even hyperscaler balance sheets, debt financing has expanded beyond data centers into chips and servers — and Wall Street keeps saying yes.

Rows of servers inside a data center. The $60 billion package would fund AI chip purchases and infrastructure leases that Anthropic and other AI companies use to run models like Claude. (Photo: 123net, CC BY-SA 3.0, via Wikimedia Commons)

Representatives for Broadcom and all of the banks declined to comment. As of October 6, no syndication letters have been confirmed sent and no new banks have been named.

Watch: Blackstone, Banks Gather $60 Billion for Broadcom AI Chip Deal — Bloomberg Television's Open Interest segment with reporter Carmen Reinicke summarizing the $60 billion AI chip financing scoop.

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Sources: The Business Times, Stocktwits via TradingView, Cryptobriefing, AI Weekly